Ceramic Leadless Chip Carriers (CLCC)
Ceramic leadless chip carriers do not have metallic external leads. The main features of the CLCCs are their compact size, their light weight, and their ability to adapt to multiple functions.
CLCC with SMD outline are now the most popular package style for crystal oscillator and SAW filters for cellular phones and other hand held wireless systems. Conventional, JEDEC and other standard types are also available. Small outline surface mount packaging can be effectively used for crystal resonators, crystal oscillators, crystal filters, RF filters, IF filters, other mobile applications and MEMS.
Leadless Chip Carriers (SMD) Features: | |
|---|---|
Ultra-miniature sizes for mobile and wireless devices | |
Standard JEDEC body sizes for conventional applications | |
High reliability ceramic materials | |
Low loss for excellent electrical performance at RF frequency | |
NTK volume manufacturing capacity | |
Wide selection of industry standard case outlines | |
Suitable for SAW filter, Crystal Resonator, Crystal Oscillator, VCO, TCXO, CMOS Image Sensors or MEMS | |
Design Overview
Package Seal options:
Solder
Seam weld (kovar ring)
Glass
Epoxy
Wire bond or flip chip connection
SLAM (single layer) or cavity-style structures
Thermal via or heat spreader designs for device temperature stabilization
Single piece or panel array (depending on part size)
Leadless (castellation type) or leaded (J-bend) types are available
Tape and reel or tray packingty
