NTK has developed low temperature cofired ceramic packages for the emerging high-speed wireless data communications market. Embedded or surface printed passives with low resistance conductors are possible in multi-layer or mono-layer structures.

Flip chip or cavity designs are possible. Thermal vias may be designed in to help maintain proper device operation temperature range.

NTK is developing lower loss and lead free materials.

Features:

Glass ceramic materials for high frequency and high speed devices

Flexible design rules allow for high density routing within the package structure

Low resistance conductors, for low loss design

Available in panel (array) or singulated form

Substrates can be designed for use with flip chip mounting or with cavity structure for wire bonding