The compact and thin package consists of a chip carrier with over 200 leads at a pitch of under 0.5mm.

Mature and reliable technology for medium to low-density devices. Quad and dual in-line standard lead configurations. Available in either: fine (  ≤   0.635mm), or gross (  ≤  1.27mm) lead pitch. Ceramic non-conductive tie bar option reduces handling difficulty with higher lead count packages.

Ceramic Flat Packs Features:

Quad or dual in-line lead configurations

Fine (0.025”) or gross (0.050”) lead pitch formats

Available with ceramic non-conductive tie bar for easier handling during test

Wide variety of JEDEC standard case outlines

Flat or J-bend lead forms

Suitable for high reliability or space level SMT applications

Flat lead frame and braze pad design

J bend lead frame design

Seal options

Bare ceramic – for epoxy or glass frit seal

Metallized pattern for solders

Kovar ring for seam weld or seam seal

Thermal management solutions

Copper tungsten (CuW) heat spreader or heat slug

Thermal vias